Modi Bond

Adhesives for Flexible Packaging​ (Solvent base , solvent less & Water Base)
Product Name Key Features
I. Solvent Base
MB-8100 (HI-BOND) • Good strength for film-to-film in flexible packaging
• PU resin with 66% for HI BOND laminates such as shampoo, oil, wheat/rice heavy laminates
• Provides good barrier & better performance
MB-8080 • General-purpose PU adhesive with 80% solid for lamination of PET, MPET, BOPP, LDPE, paper, and PE substrates
MB-4500 • Ready-to-use GP grade PU resin of 45% solid
MB-3000 • Ready-to-use GP grade PU resin of 30% solid
MB-7580 • Hardener with 75% solid to be used with MB-8100
MB-7570 • Hardener with 75% solid to be used with MB-8080
II. Solventless
MB SL 551 NCO
MB-SL 255 OH
• Used in ratio 100 parts NCO & 70 parts OH
• Solvent-free two-component PU resin with high bond strength, especially for food industry laminates
III. Water Base
MB E-101 • Acrylic-based product for lamination of PET, PVC, BOPP, CPP to paper by gravure cylinders
• High heat resistance with excellent bonding
MODI BOND 1001 SL (A) • Water-based emulsion for metal transfer from MET-PET to paper for solventless machines
• Ideal for high-speed lamination